Force Sensors For Microelectronic Packaging Applications
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| Google books | books.google.com |
|---|---|
| Authors | Oliver Brand |
| Michael Maier | |
| J. Schwizer | |
| Date of Reg. | |
| Date of Upd. | |
| ID | 2221745 |
About Force Sensors For Microelectronic Packaging Applications
Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement . . .