Routing in the Third Dimension: From VLSI Chips to MCMs photograph

Routing In The Third Dimension: From VLSI Chips To MCMs

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Originally published 1995
AuthorsAnand Panyam
N. A Sherwani
Siddharth Bhingarde
Date of Reg.
Date of Upd.
ID1953052
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About Routing In The Third Dimension: From VLSI Chips To MCMs


This key text addresses the complex computer chips of tomorrow which will consist of several layers of metal interconnect, making the interconnect within a chip or a multichip module a three dimensional problem. . . .

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